IEEE UTP Student branch in collaboration with Electrical and Electronic Engineering Department, UTP is providing an online review service ‘FYP – TechMemics‘, for UG students of EE Dept. In this platform, PG students of EE Dept will review FYP technical reports. Furthermore, the top 3 papers will be recommended for either IEEE-SCOReD Conference 2018 or IEEE-ROMA Conference 2018. For more details on the event please find the attached brochure.
 
The main aim of the service is to improve the quality of the FYP papers, technically and conceptually. Moreover, to also encourage the students to publish their papers in reputed conferences or journals.
 
The two phases of the service are:
Phase 1:

Title: Workshop on technical paper writing for FYP-II
Date: 26th March 2018
Time: 10.00am – 11.00 am
Location: Pocket C (C7)
Speaker: Assoc. prof. Dr. Irraivan Elamvazuthi, Chair, IEEE RAS Malaysia Chapter

 
Phase 2:

Title: FYP – TechMemics
Important Dates:
Paper Submission Open: 12-04-2018
Paper Submission Close: 16-04-2018
Notification of Comments: 22-04-2018
Submission of revised copy: 22-04-2018 to 25-04-2018

 
Click the link below to register.
 
Please provide your full name during the registration which will help us to print the certificate.
 
This will be a great support and a change for IEEE UTP Student branch and IEEE Malaysia Section. We are highly thankful to our strategic partner IEEE RAS Malaysia Chapter.
 
For any queries, please contact us through sbieeeutp@gmail.com.
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